Patents/Assignees

MITSUBISHI MATERIALS CORPORATION

111 patents in portfolio

US12385110utility2025
Pure Copper Plate
0 cites
US12359284utility2025
Copper Alloy, Plastically Worked Copper Alloy Material, Component for Electronic/electrical Equipment, Terminal, Heat Dissipation Substrate
0 cites
US12356554utility2025
Method for Manufacturing Bonded Body and Method for Manufacturing Insulation Circuit Substrate
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US12350742utility2025
Surface-coated Cutting Tool
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US12331386utility2025
Pure Copper Plate
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US12303982utility2025
Surface-coated Cutting Tool
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US12303986utility2025
Rotating Tool with Coolant Hole
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US12286698utility2025
Pure Copper Material, Insulating Substrate, and Electronic Device
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US12281376utility2025
Slit Copper Material, Part for Electric/electronic Device, Bus Bar, Heat Dissipation Substrate
0 cites
US12278025utility2025
Insulated Copper Wire and Electric Coil
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US12264390utility2025
Pure Copper Material, Insulating Substrate, and Electronic Device
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US12264407utility2025
Cu—ni—si Based Copper Alloy Plate, Cu—ni—si Based Copper Alloy Plate with Plating Film, and Methods of Producing the Same
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US12237164utility2025
Method of Manufacturing Electrode Plate for Plasma Processing Device and Electrode Plate for Plasma Processing Device
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US12226820utility2025
Bonding Sheet
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US12203158utility2025
Copper Alloy, Copper Alloy Plastic Working Material, Component for Electronic/electrical Device, Terminal, Bus Bar, Lead Frame, and Heat Dissipation Substrate
0 cites
US12203160utility2025
Surface-coated Cutting Tool
0 cites
US12199006utility2025
Bonded Body, Power Module Substrate, Power Module, Method for Manufacturing Bonded Body, and Method for Manufacturing Power Module Substrate
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US12186786utility2025
Method for Treating Waste Electronic Substrate
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US12183478utility2024
Treatment Method of Coated Wire
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US12177962utility2024
Insulating Resin Circuit Substrate
0 cites

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