- US11674226utility2023Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity0 cites
- US11676798utility2023Cooling for a Plasma-based Reactor0 cites
- US11670516utility2023Metal-containing Passivation for High Aspect Ratio Etch0 cites
- US11670503utility2023Method of Atomic Layer Deposition0 cites
- US11670486utility2023Pulsed Plasma Chamber in Dual Chamber Configuration0 cites
- US11670535utility2023Carrier Plate for Use in Plasma Processing Systems0 cites
- US11662237utility2023MEMS Coriolis Gas Flow Controller0 cites
- US11661654utility2023Substrate Processing Systems Including Gas Delivery System with Reduced Dead Legs0 cites
- USD0986825design2023Connector Backshell0 cites
- US11655556utility2023Flow Assisted Dynamic Seal for High-convection, Continuous-rotation Plating0 cites
- US11651991utility2023Electrostatic Chuck Design for Cooling-gas Light-up Prevention0 cites
- US11651963utility2023Method of Improving Deposition Induced CD Imbalance Using Spatially Selective Ashing of Carbon Based Film0 cites
- US11646207utility2023Silicon Oxide Silicon Nitride Stack Stair Step Etch0 cites
- US11646198utility2023Ultrathin Atomic Layer Deposition Film Accuracy Thickness Control0 cites
- US11634817utility2023Substrate Pedestal Including Backside Gas-delivery Tube0 cites
- US11637022utility2023Electron Excitation Atomic Layer Etch0 cites
- US11637037utility2023Method to Create Air Gaps0 cites
- US11628389utility2023Filter for a Plasma Plume0 cites