Patents/Assignees

JCET GROUP CO., Ltd.

18 patents in portfolio

US12616057utility2026
Double-sided Sip Packaging Structure Having Interposer Including a Groove and Manufacturing Method Thereof
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US12593731utility2026
Packaging Structure and Manufacturing Method Thereof
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US12581965utility2026
Packaging Structure and Manufacturing Method Thereof
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US12575447utility2026
QFN Packaging Structure and QFN Packaging Method
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US12562772utility2026
Magnetic Coupling-based Inter-chip Wireless Communication Interface Structure and Method for Three-dimensional Stacked Chips
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US12550261utility2026
Package Structure with Inductor, and Manufacturing Method Thereof
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US12500329utility2025
Antenna Packaging Structure and Manufacturing Method Thereof
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US12482765utility2025
Packaging Structure and Manufacturing Method Thereof
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US12476222utility2025
Fan-out Package Structure
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US12469955utility2025
Antenna Packaging Structure and Manufacturing Method Thereof
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US12368324utility2025
Inductive Coupling System and Method for Adaptive Control of Power Transfer for Wireless Three-dimensional Stacked Chip Package
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US12300590utility2025
Package Structure and Method for Forming Same
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US12249582utility2025
SIP Package Structure
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US12148681utility2024
Fan-out Package Structure and Method for Manufacturing the Same
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US12074116utility2024
Integrated Package Structure
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US12033955utility2024
Electromagnetic Shielding Package Structure Comprising Electroplating Layer and Package Method Thereof
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US11978694utility2024
Dual-substrate Antenna Package Structure and Method for Manufacturing the Same
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US11854949utility2023
Package Structure Having a Plurality of Chips Attached to a Lead Frame by Redistribution Layer
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