Patents/Assignees

ISHIHARA CHEMICAL CO., Ltd.

5 patents in portfolio

US12448690utility2025
Treatment Method After Plating with Sn or Sn Alloy
0 cites
US12388035utility2025
Structure Comprising Under Barrier Metal and Solder Layer, and Method for Producing Structure
0 cites
US11993862utility2024
Structure Including Copper Plating Layer or Copper Alloy Plating Layer
0 cites
US11946153utility2024
Copper or Copper Alloy Electroplating Bath
0 cites
US11939691utility2024
Tin or Tin Alloy Electroplating Bath, and Electronic Component Having Electrodeposit Formed Thereon Using the Plating Bath
0 cites