- US11694987utility2023Active Package Substrate Having Anisotropic Conductive Layer0 cites
- US11694986utility2023Vias in Composite IC Chip Structures0 cites
- US11694976utility2023Bowl Shaped Pad0 cites
- US11694962utility2023Microelectronic Package with Mold-integrated Components0 cites
- US11694960utility2023Bridge Interconnection with Layered Interconnect Structures0 cites
- US11694959utility2023Multi-die Ultrafine Pitch Patch Architecture and Method of Making0 cites
- US11694952utility2023Horizontal Pitch Translation Using Embedded Bridge Dies0 cites
- US11694951utility2023Zero-misalignment Two-via Structures0 cites
- US11694942utility2023Annular Silicon-embedded Thermoelectric Cooling Devices for Localized On-die Thermal Management0 cites
- US11694898utility2023Hybrid Fine Line Spacing Architecture for Bump Pitch Scaling0 cites
- US11694836utility2023On-chip Multi-layer Transformer and Inductor0 cites
- US11694651utility2023Delivery of Display Symbols to a Display Source0 cites
- US11694299utility2023Methods and Apparatus to Emulate Graphics Processing Unit Instructions0 cites
- US11694077utility2023Methods, Systems, and Articles of Manufacture to Autonomously Select Data Structures0 cites
- US11693940utility2023Partitioned Platform Security Mechanism0 cites
- US11693810utility2023Interface Bridge Between Integrated Circuit Die0 cites
- US11693807utility2023Dynamic Configuration of Input/output Controller Access Lanes0 cites
- US11693785utility2023Memory Tagging Apparatus and Method0 cites
- US11693780utility2023System, Method, and Apparatus for Enhanced Pointer Identification and Prefetching0 cites
- US11693756utility2023Technologies for Managing Memory on a Compute Device0 cites