- US12554495utility2026Processor Having Multiple Cores, Shared Core Extension Logic, and Shared Core Extension Utilization Instructions0 cites
- US12554500utility2026Tag Checking Procedure Calls0 cites
- US12554494utility2026Apparatuses, Methods, and Systems for Instructions to Request a History Reset of a Processor Core0 cites
- US12554547utility2026Silicon Usage Metering to Provide Silicon-as-a-service0 cites
- US12554644utility2026Hierarchical Core Valid Tracker for Cache Coherency0 cites
- US12555506utility2026Resonant Clocking Employing Resonance at Fundamental and Harmonic Frequencies0 cites
- US12554489utility2026Supporting 8-bit Floating Point Format Operands in a Computing Architecture0 cites
- US12556216utility2026Distributed Radiohead System0 cites
- US12556496utility2026Wormhole Backplane Ultrahigh Density Optical Routing System0 cites
- US12554077utility2026Semiconductor Package with Embedded Optical Die0 cites
- US12555555utility2026Flicker Free Experience in Variable Refresh Rate (VRR) Panels via Frame Duration Balancing0 cites
- US12557675utility2026Inorganic Redistribution Layer on Organic Substrate in Integrated Circuit Packages0 cites
- US12557628utility2026Organic Film Stress Buffer for Interface of Metal and Dielectric0 cites
- US12557665utility2026Embedded Semiconductive Chips in Reconstituted Wafers, and Systems Containing Same0 cites
- US12557625utility2026Spacer Self-aligned via Structures Using Directed Self Assembly for Gate Contact or Trench Contact0 cites
- US12557363utility2026Gate Cut Structures Formed Before Dummy Gate0 cites
- US12557594utility2026Device and Method for Real-time Offset Adjustment of a Semiconductor Die Placement0 cites
- US12557683utility2026Solder Grid Array for Attachment of a Die Package0 cites
- US12557617utility2026Continuous Gate and Fin Spacer for Advanced Integrated Circuit Structure Fabrication0 cites
- US12557216utility2026Type-3 Printed Circuit Boards (PCBS) with Hybrid Layer Counts0 cites