Patents/Assignees

INDIUM CORPORATION

14 patents in portfolio

US12451402utility2025
Liquid Metal Thermal Interface
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US12300567utility2025
Solid Metal Foam Thermal Interface Material
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US12240060utility2025
Snin Solder Alloys
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US12090579utility2024
High Reliability Lead-free Solder Alloys for Harsh Environment Electronics Applications
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US12042864utility2024
Thermally Decomposing Build Plate with Casting Mold for Facile Release of 3D Printed Objects
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US12023735utility2024
Thermally Decomposable Build Plate Structure for Stabilization of Metal Build Surface During 3D Printing and Facile Release of 3D Printed Objects
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US11999018utility2024
Snbi and Snin Solder Alloys
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US11807536utility2023
Method for Preparing Graphite Sheets with Piercing Treatment to Enhance Thermal Conduction
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US11766721utility2023
Thermally Decomposing Build Plate for Facile Release of 3D Printed Objects
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US11752579utility2023
High Reliability Leadfree Solder Alloys for Harsh Service Conditions
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US11738411utility2023
Lead-free Solder Paste with Mixed Solder Powders for High Temperature Applications
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US11712762utility2023
Low Temperature Melting and Mid Temperature Melting Lead-free Solder Paste with Mixed Solder Alloy Powders
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US11602808utility2023
Solder Preform with Internal Flux Core Including Thermochromic Indicator
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US11581239utility2023
Lead-free Solder Paste as Thermal Interface Material
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