Patents/Assignees

IBIDEN CO., Ltd.

107 patents in portfolio

US12020843utility2024
Inductor Built-in Substrate and Method for Manufacturing Inductor Built-in Substrate
0 cites
US12010794utility2024
Printed Wiring Board and Method for Manufacturing the Same
0 cites
US12010796utility2024
Wiring Substrate and Method for Manufacturing Wiring Substrate
0 cites
US11996357utility2024
Wiring Substrate and Method for Manufacturing Wiring Substrate
0 cites
US11963492utility2024
Agent for Increasing a Plant Functional Component Content and a Method for Manufacturing the Same
0 cites
US11963298utility2024
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
0 cites
US11956896utility2024
Printed Wiring Board
0 cites
US11935801utility2024
Electronic Component Built-in Wiring Board and Method for Manufacturing the Same
0 cites
US11935822utility2024
Wiring Substrate Having Metal Post Offset from Conductor Pad and Method for Manufacturing Wiring Substrate
0 cites
US11925180utility2024
Antiviral Substrate, Antiviral Composition, Method for Manufacturing Antiviral Substrate, Antimicrobial Substrate, Antimicrobial Composition and Method for Manufacturing Antimicrobial Substrate
0 cites
US11930589utility2024
Printed Wiring Board and Method for Manufacturing the Same
0 cites
US11930601utility2024
Method for Manufacturing Printed Wiring Board
0 cites
US11917756utility2024
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
0 cites
US11903128utility2024
Wiring Substrate
0 cites
US11887767utility2024
Inductor Built-in Substrate and Method for Manufacturing the Same
0 cites
US11882656utility2024
Wiring Substrate and Method for Manufacturing Wiring Substrate
0 cites
US11866378utility2024
Method for Producing Honeycomb Structure
0 cites
US11871515utility2024
Wiring Substrate
0 cites
US11856699utility2023
Inductor Built-in Substrate
0 cites
US11832397utility2023
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
0 cites

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