Patents/Assignees

HOJIN PLATECH CO., Ltd.

2 patents in portfolio

US12071703utility2024
Electroplating Solution for Indium-bismuth Alloy for Low-temperature Solder with Improved Bismuth Substitution Prevention Performance
0 cites
US11879181utility2024
Electroplating Solution of Tin or Tin Alloy with Improved Thickness Variation of Wafer Bumps
0 cites