Patents/Assignees

HD MICROSYSTEMS, Ltd.

6 patents in portfolio

US12601970utility2026
Photosensitive Resin Composition, Method for Manufacturing Patterned Cured Product, Cured Product, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, and Electronic Component
0 cites
US12386256utility2025
Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, and Electronic Component
0 cites
US12386257utility2025
Photosensitive Resin Composition, Method of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, and Electronic Component
0 cites
US11807721utility2023
Method for Producing Polyimide Precursor, Method for Producing Photosensitive Resin Composition, Method for Producing Pattern Cured Product, Method for Producing Interlayer Insulating Film, Cover Coat Layer or Surface Protective Film, and Method for Producing Electronic Component
0 cites
US11592743utility2023
Positive-type Photosensitive Resin Composition
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US11592744utility2023
Positive-type Photosensitive Resin Composition
0 cites