Patents/Assignees

EV Group E. Thallner GmbH

37 patents in portfolio

US12062521utility2024
Method for Prefixing of Substrates
0 cites
US12025426utility2024
Measuring Device and Method for Determining the Course of a Bonding Wave
0 cites
US12027383utility2024
Device for Alignment of Two Substrates
0 cites
US11990463utility2024
Device for Bonding Chips
0 cites
US11955339utility2024
Device and Method for Bonding of Substrates
0 cites
US11901172utility2024
Method and Device for the Surface Treatment of Substrates
0 cites
US11865824utility2024
Method and Device for Transferring a Transfer Layer
0 cites
US11862466utility2024
Method and Device for Bonding Substrates
0 cites
US11862487utility2024
Device and Method for Bonding of Two Substrates
0 cites
US11776842utility2023
Method and Device for Surface Treatment of Substrates
0 cites
US11764198utility2023
Method and Device for Bonding of Chips
0 cites
US11756818utility2023
Accommodating Device for Retaining Wafers
0 cites
US11742205utility2023
Method and Device for Bonding of Substrates
0 cites
US11697281utility2023
Device and Method for Bonding Substrates
0 cites
US11680792utility2023
Incoming Runout Measurement Method
0 cites
US11681228utility2023
Method and Apparatus for Illuminating Image Points
0 cites
US11562912utility2023
Device and Method for Bonding of Two Substrates
0 cites

← PreviousPage 2 of 2