Patents/Assignees

DOOSAN CORPORATION

9 patents in portfolio

US12410347utility2025
Adhesive Composition, and Coverlay Film and Printed Circuit Board That Include the Same
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US12378448utility2025
Non-conductive Adhesive Film for Semiconductor Package and Semiconductor Package Manufacturing Method Using Same
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US12278117utility2025
Underfill Film for Semiconductor Package and Method for Manufacturing Semiconductor Package Using the Same
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US12274009utility2025
Laminator
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US12219715utility2025
System and Method for Manufacturing Composite Board
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US12082348utility2024
System and Method for Manufacturing Composite Substrate
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US11942336utility2024
Underfill Film for Semiconductor Package and Method for Manufacturing Semiconductor Package Using the Same
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US11820885utility2023
Resin Composition, Metal Laminate and Printed Circuit Board Using Same, and Method for Manufacturing Metal Laminate
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US11814275utility2023
Forklift Truck
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