Patents/Assignees

DISCO CORPORATION

399 patents in portfolio

US12211731utility2025
Wafer Processing Method
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US12211732utility2025
Method of Transferring Wafer
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US12202173utility2025
Method of Manufacturing Monocrystalline Silicon Substrate
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US12194571utility2025
Wafer Forming Method
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US12198990utility2025
Wafer Manufacturing Method and Laminated Device Chip Manufacturing Method
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US12186857utility2025
Wafer Processing Method
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US12191172utility2025
Tape Mounter
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US12191138utility2025
Processing Method of Workpiece
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US12191204utility2025
Method of Processing Wafer and Processing Apparatus for Wafer
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US12191213utility2025
Inspection Method
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US12191216utility2025
Laser Processing Apparatus and Method of Correcting Converged Spot Position
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US12181691utility2024
Inspecting Apparatus
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US12181267utility2024
Measuring Method
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US12183635utility2024
Wafer Processing Method and Wafer Processing Apparatus
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US12170211utility2024
Laser Processing Apparatus
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US12170224utility2024
Method of Processing Wafer
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US12170225utility2024
Laser Processing Method
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US12151312utility2024
Laser Processing Apparatus
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US12151339utility2024
Grinding Wheel and Wafer Grinding Method
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US12151401utility2024
Edge Alignment Method
0 cites

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