Patents/Assignees

Daewon Semiconductor Packaging Industrial Company

4 patents in portfolio

US12387957utility2025
Rigid Carrier Assemblies with Tacky Media Molded Thereon
0 cites
US12154805utility2024
Patterned Carrier Assemblies Having an Integrated Adhesive Film
0 cites
US12106988utility2024
Separators for Handling, Transporting, or Storing Semiconductor Wafers
0 cites
US11764133utility2023
Tape Carrier Assemblies Having an Integrated Adhesive Film
0 cites