Patents/Assignees

Besi Netherlands B.V.

6 patents in portfolio

US12420465utility2025
Method and Mould for Encapsulating Electronic Components Mounted on a Carrier
0 cites
US12384081utility2025
Mould Half and Mould Method for Transfer Moulding Encapsulating Electronic Components Mounted on a Carrier Including a Dual Support Surface and a Method for Using Such
0 cites
US11935764utility2024
Sawing Device and Method for Forming Saw-cuts Into a Semiconductor Product
0 cites
US11887872utility2024
Method and Device for Selectively Separating Electronic Components from a Frame with Electronic Components
0 cites
US11842909utility2023
Press, Actuator Set and Method for Encapsulating Electronic Components with at Least Two Individual Controllable Actuators
0 cites
US11554523utility2023
Press Part for Supporting a Mould Part for Encapsulating Electronic Components Mounted on a Carrier and a Press Comprising the Press Part
0 cites