Patents/Assignees

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

37 patents in portfolio

US12610451utility2026
Component Carrier with an Embedded Thermally Conductive Block and Manufacturing Method
0 cites
US12543267utility2026
Magnetic Inlay with an Adjustable Inductance Value for a Component Carrier and a Manufacturing Method
0 cites
US12507350utility2025
Manufacturing Component Carrier with Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material
0 cites
US12501551utility2025
Method for Embedding a Component in a Printed Circuit Board
0 cites
US12495498utility2025
Component Carrier Interconnection and Manufacturing Method
0 cites
US12490382utility2025
Coreless Component Carrier with Embedded Components
0 cites
US12484154utility2025
Inlay with Exposed Porous Layer, Component Carrier and Manufacturing Methods
0 cites
US12463124utility2025
Component Carrier with Surface Mounted Components Connected by High Density Connection Region
0 cites
US12464649utility2025
Component Carrier with Inductive Element Included in Layer Build-up, and Manufacturing Method
0 cites
US12424504utility2025
Component Embedded in Component Carrier and Having an Exposed Side Wall
0 cites
US12382585utility2025
Method for Embedding a Component in a Printed Circuit Board
0 cites
US12322622utility2025
Component Carrier with Gap Around Component Core and Filled with First Material in Bottom Portion and with Second Material in Top Portion
0 cites
US12324091utility2025
Component Carrier for Microwave Applications with Stack Pieces Interconnected at an Electrically Conductive Connection Interface
0 cites
US12279369utility2025
Electrically Connected Component Carrier Stacks with Respective Cavities and Method of Manufacturing the Same
0 cites
US12279372utility2025
Component Carrier with a Magnetic Element and a Manufacturing Method
0 cites
US12219701utility2025
Component Carrier
0 cites
US12185478utility2024
Printed Circuit Board Having Embedded Component
0 cites
US12165940utility2024
Component Carrier with Surface-contactable Component Embedded in Laminated Stack
0 cites
US12165964utility2024
Component Carrier with Embedded Interposer Laterally Between Electrically Conductive Structures of Stack and Method for Manufacturing the Component Carrier
0 cites
US12136580utility2024
Embedding Methods for Fine-pitch Components and Corresponding Component Carriers
0 cites

Page 1 of 2Next →