Patents/Assignees

Amkor Technology Singapore Holding Pte. Ltd.

178 patents in portfolio

US12334450utility2025
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
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US12327812utility2025
Semiconductor Device and Manufacturing Method Thereof
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US12322731utility2025
Semiconductor Package Using a Coreless Signal Distribution Structure
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US12315845utility2025
Electronic Device Having a Substrate-to-substrate Interconnection Structure and Manufacturing Method Thereof
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US12300582utility2025
Method of Forming a Packaged Semiconductor Device Having Enhanced Wettable Flank and Structure
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US12300584utility2025
Semiconductor Device Including Heat Sink with Exposed Side from Encapsulant and a Method of Manufacturing Thereof
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US12300638utility2025
Method of Forming an Electronic Device Structure Having an Electronic Component with an On-edge Orientation and Related Structures
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US12288728utility2025
Semiconductor Device and Method of Manufacturing a Semiconductor Device
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US12288764utility2025
Semiconductor Device and Manufacturing Method Thereof
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US12278154utility2025
Semiconductor Device and a Method of Manufacturing a Semiconductor Device
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US12278196utility2025
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
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US12272655utility2025
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
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US12261145utility2025
Semiconductor Device and Methods of Manufacturing Semiconductor Devices
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US12255197utility2025
Package-on-package Type Semiconductor Package
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US12243834utility2025
Semiconductor Package with EMI Shield and Fabricating Method Thereof
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US12237239utility2025
Semiconductor Device and Manufacturing Method Thereof
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US12230661utility2025
Electronic Device Package and Fabricating Method Thereof
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US12221339utility2025
Semiconductor Device and Method of Manufacturing Semiconductor Device
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US12224230utility2025
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
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US12211705utility2025
Stiffener Package and Method of Fabricating Stiffener Package
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