Patents/Assignees

Alpha Assembly Solutions Inc.

17 patents in portfolio

US12438121utility2025
Sintering Materials and Attachment Methods Using Same
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US12421574utility2025
High Reliability Lead-free Solder Alloy for Electronic Applications in Extreme Environments
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US12388042utility2025
Solder Material and Method for Die Attachment
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US12278022utility2025
Stretchable Interconnects for Flexible Electronic Surfaces
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US12246376utility2025
Sinter-ready Silver Films
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US12233483utility2025
Low Temperature Soldering Solutions for Polymer Substrates, Printed Circuit Boards and Other Joining Applications
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US12122679utility2024
Applications of Engineered Graphene
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US12115602utility2024
Lead-free Solder Compositions
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US12113039utility2024
Low Pressure Sintering Powder
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US12084583utility2024
Dielectric Ink Composition
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US11929341utility2024
Nano Copper Paste and Film for Sintered Die Attach and Similar Applications
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US11842974utility2023
Solder Material and Method for Die Attachment
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US11830640utility2023
Stretchable Interconnects for Flexible Electronic Surfaces
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US11732330utility2023
High Reliability Lead-free Solder Alloy for Electronic Applications in Extreme Environments
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US11724342utility2023
Cost-effective Lead-free Solder Alloy for Electronic Applications
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US11699632utility2023
Methods for Attachment and Devices Produced Using the Methods
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US11577343utility2023
Low-silver Alternative to Standard SAC Alloys for High Reliability Applications
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