Patents/Assignees

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.

141 patents in portfolio

US12500138utility2025
Cooling Channel Shape with Substantially Constant Cross Sectional Area
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US12482776utility2025
Metal Pads Over TSV
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US12456662utility2025
Structures with Through-substrate Vias and Methods for Forming the Same
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US12451439utility2025
Bonded Structure Including an Obstructive Element Directly Bonded to a Semiconductor Element Without an Adhesive
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US12451445utility2025
Protective Elements for Bonded Structures
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US12438122utility2025
DBI to Si Bonding for Simplified Handle Wafer
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US12431449utility2025
Circuitry for Electrical Redundancy in Bonded Structures
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US12431460utility2025
Die Processing
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US12424584utility2025
Direct Bonding Methods and Structures
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US12417950utility2025
Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate
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US12412808utility2025
Cold Plate and Manifold Integration for High Reliability
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US12406959utility2025
Post CMP Processing for Hybrid Bonding
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US12406975utility2025
Techniques for Processing Devices
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US12401011utility2025
Stacked Devices and Methods of Fabrication
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US12381119utility2025
Seal for Microelectronic Assembly
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US12381128utility2025
Structures with Through-substrate Vias and Methods for Forming the Same
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US12381168utility2025
Conductive Barrier Direct Hybrid Bonding
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US12381173utility2025
Direct Hybrid Bonding of Substrates Having Microelectronic Components with Different Profiles And/or Pitches at the Bonding Interface
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US12374556utility2025
Processing Stacked Substrates
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US12374641utility2025
Sealed Bonded Structures and Methods for Forming the Same
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