Patents/Assignees

Absolics Inc.

12 patents in portfolio

US12506040utility2025
Packaging Substrate, Semiconductor Package, Packaging Substrate Preparation Method, and Semiconductor Package Preparation Method
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US12469736utility2025
Substrate Carrier and Substrate Assembly Comprising the Same
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US12456653utility2025
Packaging Substrate and Semiconductor Device Comprising the Same
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US12456672utility2025
Packaging Substrate Having Element Group in Cavity Unit and Semiconductor Device Comprising the Same
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US12288742utility2025
Packaging Substrate and Semiconductor Apparatus Comprising Same
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US12198994utility2025
Packaging Substrate and Method for Manufacturing Same
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US12165979utility2024
Packaging Substrate and Semiconductor Apparatus Comprising Same
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US12027454utility2024
Packaging Substrate Having Electric Power Transmitting Elements on Non-circular Core via of Core Vias and Semiconductor Device Comprising the Same
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US11981501utility2024
Loading Cassette for Substrate Including Glass and Substrate Loading Method to Which Same Is Applied
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US11967542utility2024
Packaging Substrate, and Semiconductor Device Comprising Same
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US11728259utility2023
Packaging Substrate Having Electric Power Transmitting Elements on Non-circular Core via of Core Vias and Semiconductor Device Comprising the Same
0 cites
US11652039utility2023
Packaging Substrate with Core Layer and Cavity Structure and Semiconductor Device Comprising the Same
0 cites