Claims (1)
Claim 1 (Independent)
The ornamental design for power semiconductor module as shown.
Full Description
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FIG. 1 is a front perspective view of a power semiconductor module showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is an exploded perspective view of a power semiconductor module showing my new design.
The broken lines illustrate portions of the power semiconductor module and form no part of the claimed design.
Citations
This patent cites (13)
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