Power Semiconductor Module

FIG. 1 is a front, left, and bottom side perspective view of a first embodiment of a power semiconductor module, showing our new design; FIG. 2 is a front, right, and top side perspective view of FIG. 1 ; FIG. 3 is a front view of FIG. 1 ; FIG. 4 is a rear view of FIG. 1 ; FIG. 5 is a left side view of FIG. 1 ; FIG. 6 is a right side view of FIG. 1 ; FIG. 7 is a top view of FIG. 1 ; FIG. 8 is a bottom view of FIG. 1 ; FIG. 9 is an exploded view of FIG. 1 ; FIG. 10 is a front, left, and bottom side perspective view of the terminal module in FIG. 9 , with the broken lines of the cover and the case body not shown for ease of illustration; FIG. 11 is a rear, right, and top side perspective view of FIG. 9 ; FIG. 12 is a front view of FIG. 9 ; FIG. 13 is a rear view of FIG. 9 ; FIG. 14 is a left side view of FIG. 9 ; FIG. 15 is a right side view of FIG. 9 ; FIG. 16 is a top view of FIG. 9 ; FIG. 17 is a bottom view of FIG. 9 ; FIG. 18 is a front, left, bottom exploded perspective view of FIG. 10 ; FIG. 19 is a rear, right, and top exploded perspective view of FIG. 18 ; FIG. 20 is a front, left, and bottom side perspective view of the first terminal part of the terminal module in FIG. 18 , shown separately for ease of illustration; FIG. 21 is a rear, right, and top side perspective view of FIG. 20 ; FIG. 22 is a front view of FIG. 20 ; FIG. 23 is a rear view of FIG. 20 ; FIG. 24 is a left side view of FIG. 20 ; FIG. 25 is a right side view of FIG. 20 ; FIG. 26 is a top view of FIG. 20 ; FIG. 27 is a bottom view of FIG. 20 ; FIG. 28 is a front, left, and bottom side perspective view of the second terminal part of the terminal module in FIG. 18 , shown separately for ease of illustration; FIG. 29 is a rear, right, and top side perspective view of FIG. 28 ; FIG. 30 is a front view of FIG. 28 ; FIG. 31 is a rear view of FIG. 28 ; FIG. 32 is a left side view of FIG. 28 ; FIG. 33 is a right side view of FIG. 28 ; FIG. 34 is a top view of FIG. 28 ; FIG. 35 is a bottom view of FIG. 28 ; FIG. 36 is a front, left, and bottom exploded perspective view of a second embodiment of a power semiconductor module, showing our new design; FIG. 37 is a rear, right and top exploded perspective view of FIG. 36 ; FIG. 38 is a front, left, and bottom side perspective view of the first terminal part of the terminal module in FIG. 36 , shown separately for ease of illustration; FIG. 39 is a bottom view of FIG. 38 ; FIG. 40 is a rear, right, and top side perspective view of the second terminal part of the terminal module in FIG. 36 , shown separately for ease of illustration; FIG. 41 is a front view of FIG. 40 ; FIG. 42 is a rear view of FIG. 40 ; FIG. 43 is a left side view of FIG. 40 ; FIG. 44 is a right side view of FIG. 40 ; FIG. 45 is a top view of FIG. 40 ; FIG. 46 is a front, left, and bottom side perspective view of a third embodiment of a power semiconductor module, showing our new design; FIG. 47 is a front, right, and top side perspective view of FIG. 46 ; FIG. 48 is a front view of FIG. 46 ; FIG. 49 is an exploded perspective view of FIG. 46 ; FIG. 50 is a front, left, and bottom side perspective view of the terminal module in FIG. 46 , with the broken lines of the cover and case body not shown for ease of illustration; FIG. 51 is a rear, right, and top side perspective view of FIG. 50 ; FIG. 52 is a front view of FIG. 50 ; FIG. 53 is a rear view of FIG. 50 ; FIG. 54 is a left side view of FIG. 50 ; FIG. 55 is a right side view of FIG. 50 ; FIG. 56 is a top view of FIG. 50 ; and, FIG. 57 is a bottom view of FIG. 50 . The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.