Claims (1)
Claim 1 (Independent)
The ornamental design for a circuit board with heat sink, as shown and described.
Full Description
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FIG. 1 is a front, right side perspective view of a circuit board with heat sink, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a left side view thereof; and,
FIG. 8 is a rear, left side perspective view thereof.
The even dashed broken lines shown in the drawings represent portions of the circuit board with heat sink that form no part of the claimed design.
Citations
This patent cites (43)
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