Patents.us
Patents/USD1100004

Solder Pad

USD1100004No. D 1,100,004designGranted 10/28/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a solder pad, as shown and described.

Full Description

Show full text →

FIG. 1 is a first perspective view of a solder pad showing my new design;

FIG. 2 is a second perspective view thereof;

FIG. 3 is a front view of FIG. 1 ;

FIG. 4 is a rear view of FIG. 1 ;

FIG. 5 is a left side view of FIG. 1 ;

FIG. 6 is a right side view of FIG. 1 ;

FIG. 7 is a top plan view of FIG. 1 ;

FIG. 8 is a bottom plan view of FIG. 1 ; and,

FIG. 9 is an explosion view thereof.

The broken lines in the drawings depict portions of the solder pad that form no part of the claimed design.

Citations

This patent cites (13)

  • US4557411
  • US5839641
  • USD497953
  • USD806045
  • USD806659
  • USD816623
  • USD845368
  • USD935721
  • USD951351
  • USD1069457
  • USD1071464
  • USD1072048
  • US2018/0368259