Claims (1)
The ornamental design for a circuit board, as shown and described.
Full Description
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FIG. 1 is a perspective view of a new design for a circuit board;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof;
FIG. 7 is another perspective view of a new design for a circuit board;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a right side elevational view thereof;
FIG. 10 is a left side elevational view thereof;
FIG. 11 is a top plan view thereof;
FIG. 12 is a bottom plan view thereof; and,
FIG. 13 is a rear elevational view thereof.
The broken lines shown in the drawings illustrate unclaimed portions and form no part of the claimed design.
Citations
This patent cites (64)
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