Stamp Component for Transferring Microstructure

FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;

FIG. 2 is a front elevational view thereof, the rear elevational view being identical thereto;

FIG. 3 is a left side elevational view thereof, the right side elevational view being identical thereto;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is an enlarged portion view labeled, “ 6 ,” in FIG. 1 ;

FIG. 7 is an enlarged portion view labeled, “ 7 ,” in FIG. 6 ;

FIG. 8 is an enlarged portion view labeled, “ 8 ,” in FIG. 2 ; and,

FIG. 9 is an enlarged portion view labeled, “ 9 ,” in FIG. 8 .

The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 6 - 9 in FIGS. 1 , 2 , and 6 - 9 and form no part of the claimed design.