Claims (1)
Claim 1 (Independent)
The ornamental design for a headphone module, as shown and described.
Full Description
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FIG. 1 is a front, left perspective view of a headphone module showing the new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is an alternative front elevation view thereof, with the ear cups in a retracted position.
The broken dashed lines form no part of the claimed design.
Citations
This patent cites (55)
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