Claims (1)
The ornamental design for a cooler for electronic devices as shown and described.
Full Description
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FIG. 1 is a perspective view illustrating the overall shape of the cooler for electronic devices, showing our new design;
FIG. 2 is a front view depicting the front portion of the design;
FIG. 3 is a rear view illustrating the rear portion of the design;
FIG. 4 a left side view portraying the left side portion of the design;
FIG. 5 is a right side view depicting the right side portion of the design;
FIG. 6 is a top view illustrating the top portion of the design; and,
FIG. 7 is a bottom view showing the bottom portion of the design.
The materials of this design include metal and synthetic resin.
This design serves as a cooler for electronic devices with elevated temperatures, comprising thermal components, a heat sink, and a cooling fan. The distinctive feature is the cooling fan circulating air over the heat sink, which dissipates heat conducted from the thermal components.
Citations
This patent cites (24)
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