Patents/USD1076074

Bond Pattern for Substrate

USD1076074No. D 1,076,074designGranted 5/20/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for the bond pattern for a substrate, as shown and described.

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is a perspective view of a bond pattern for a substrate;

is a view of the front side of the bond pattern for a substrate of ;

is a view of the right side of the bond pattern for a substrate of ;

is a view of the back side of the bond pattern for a substrate of ;

is a view of the left side of the bond pattern for a substrate of ;

is a view of the top side of the bond pattern for a substrate of ; and,

is a view of the bottom side of the bond pattern for a substrate of .

The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.