Claims (1)
Claim 1 (Independent)
The ornamental design for a contact wafer, as shown and described.
Full Description
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FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;
FIG. 2 is a top, back, and left side perspective view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a back elevation view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The Dash-Dash broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design. The Dash-Dot broken lines in the drawing views are included to show claim boundaries that form no part of the claimed design.
Citations
This patent cites (36)
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