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Patents/USD1057664

Housing for Electric and Electronic Components

USD1057664No. D 1,057,664designGranted 1/14/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a housing for electric and electronic components as shown and described.

Full Description

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The file of this patent contains at least one drawing/photograph executed in color. Copies of this patent with color drawing(s)/photograph(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a top, front perspective view of a first embodiment of a housing for electric and electronic components showing my new design;

FIG. 2 is a bottom, front perspective view thereof;

FIG. 3 is a top, rear perspective view thereof;

FIG. 4 is a bottom, rear perspective view thereof;

FIG. 5 is a right side elevation view thereof, the left side being a mirror image of the right side;

FIG. 6 is a top elevation view thereof;

FIG. 7 is a bottom elevation view thereof;

FIG. 8 is a rear elevation view thereof;

FIG. 9 is a front elevation view thereof;

FIG. 10 is a top, front perspective view of a second embodiment of a housing for electric and electronic components showing my new design;

FIG. 11 is a bottom, front perspective view thereof;

FIG. 12 is a top, rear perspective view thereof;

FIG. 13 is a bottom, rear perspective view thereof;

FIG. 14 is a right side elevation view thereof, the left side being a mirror image of the right side;

FIG. 15 is a top elevation view thereof;

FIG. 16 is a bottom elevation view thereof;

FIG. 17 is a rear elevation view thereof; and,

FIG. 18 is a front elevation view thereof.

The broken lines and ghosted portions within the broken lines show portions of the article that form no part of the claimed design.

Citations

This patent cites (10)

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  • USD437586
  • USD579417
  • USD593970
  • US9742169
  • US9787074
  • USD981349
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  • US2022/0009428
  • US2022/0244478