Wafer Support of Semiconductor Manufacturing Apparatus

FIG. 1 is a front, top and right side perspective view of a wafer support of semiconductor manufacturing apparatus showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken along line 8 - 8 in FIG. 2 thereof;

FIG. 9 is an enlarged cross-sectional view taken along line 9 - 9 in FIG. 2 thereof;

FIG. 10 is an enlarged cross-sectional view taken along line 10 - 10 in FIG. 2 thereof; and,

FIG. 11 is an enlarged view taken from the broken line box labeled 11 in FIG. 1 .

The broken lines in FIG. 1 and FIG. 11 show the boundary of the enlarged portion views and form no part of the claimed design.