Claims (1)
Claim 1 (Independent)
The ornamental design for a semiconductor module, as shown and described.
Full Description
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FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module thereof;
FIG. 3 is a left view of the semiconductor module thereof;
FIG. 4 is a right view of the semiconductor module thereof;
FIG. 5 is a top side view of the semiconductor module thereof; and,
FIG. 6 is a bottom side view of the semiconductor module thereof.
The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.
Citations
This patent cites (38)
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