Claims (1)
Claim 1 (Independent)
The ornamental design for a power semiconductor module, as shown and as described.
Full Description
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FIG. 1 is a right, front, top perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
The broken lines are shown for environmental purposes only and form no part of the claimed design.
All surfaces not shown form no part of the claimed design.
Citations
This patent cites (45)
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