Claims (1)
Claim 1 (Independent)
The ornamental design for a semiconductor module, as shown and described.
Full Description
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FIG. 1 is a front, top and right side perspective view of a semiconductor module showing my design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a tight side view thereof, the left side vim being an identical image of FIG. 7 .
Citations
This patent cites (9)
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