Claims (1)
Claim 1 (Independent)
The ornamental design for a heat dissipation module, as shown and described.
Full Description
Show full text →
FIG. 1 is a perspective view of a heat dissipation module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a reference view showing the heat dissipation module.
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.
Citations
This patent cites (19)
- USD567771
- USD715750
- USD722574
- USD954005
- USD971862
- US20160219756
- US20170307299
- US20190128617
- US20190170446
- US20200393201
- US20210018272
- US20230213288
- US20230337398
- US20230349644
- US20230354552
- US20230358482
- US218244170
- US116952033
- US116997131