Wafer Support of Semiconductor Manufacturing Apparatus
Claims (1)
The ornamental design for a wafer support of semiconductor manufacturing apparatus, as shown and described.
Full Description
Show full text →
FIG. 1 is a front, top and right side perspective view of a wafer support of semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8 - 8 in FIG. 2 ; and,
FIG. 9 is an enlarged view taken from encircled portion labeled, “ 9 ,” in FIG. 8 .
The broken lines in FIGS. 8 and 9 define the boundary of the enlarged portion view of FIG. 9 and form no part of the claimed design.
Citations
This patent cites (22)
- US4355974
- USD291413
- US4993559
- USD361752
- USD366868
- USD378675
- USD378823
- USD404015
- USD409158
- USD411176
- US6065615
- US6095806
- US6171400
- USD570308
- USD570309
- USD580894
- USD616394
- USD616395
- USD791721
- USD893438
- USD926715
- US20020092815