Claims (1)
The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a semiconductor module showing my new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof, the rear view being a mirror image of FIG. 3 ;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is a cross-sectional view taken along line 8 - 8 in FIG, 5 thereof;
FIG. 9 is a cross-sectional view taken along line 9 - 9 in FIG. 5 thereof;
FIG. 10 is a cross-sectional view taken along line 10 - 10 in FIG. 5 thereof; and,
FIG. 11 is a cross-sectional view taken along line 11 - 11 in FIG. 5 thereof.
Citations
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