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Patents/USD1013647

Semiconductor Module

USD1013647No. D 1,013,647designGranted 2/6/2024

Claims (1)

Claim 1 (Independent)

The ornamental design for a semiconductor module, as shown and described.

Full Description

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FIG. 1 is a rear, bottom, and left side perspective view of a semiconductor module showing my new design;

FIG. 2 is a front, top, and right side perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a cross-sectional view taken along line 6 - 6 in FIG. 4 thereof; and,

FIG. 7 is a cross-sectional view taken along line 7 - 7 in FIG. 4 thereof.

The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Citations

This patent cites (14)

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