Claims (1)
Claim 1 (Independent)
The ornamental design for a wire lead-in device, as shown and described.
Full Description
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FIG. 1 is a front elevational view of a wire lead-in device showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan viewt hereof;
FIG. 5 is a right side elevational view thereof, a left side elevational view being symmetrical;
FIG. 6 is a perspective view thereof;
FIG. 7 is a sectional view taken along line 7 - 7 in FIG. 3 thereof;
FIG. 8 is a sectional view taken along line 8 - 8 in FIG. 3 thereof; and,
FIG. 9 is a sectional view taken along line 9 - 9 in FIG. 3 thereof.
Citations
This patent cites (6)
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- USD887366
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