Claims (1)
Claim 1 (Independent)
The ornamental design for a power semiconductor module, as shown and described.
Full Description
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FIG. 1 is a front, top and left side perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side view thereof; and,
FIG. 8 is a left side view thereof.
The even broken lines illustrate portions of the power semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Citations
This patent cites (68)
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