Claims (1)
Claim 1 (Independent)
The ornamental design for a semiconductor module, as shown and described.
Full Description
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FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof, the rear view being a mirror image of FIG. 3 ;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side view thereof; and,
FIG. 7 is a left side view thereof.
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines is translucent.
Citations
This patent cites (31)
- USD790491
- USD796459
- USD824866
- USD845921
- USD853341
- USD853343
- USD856947
- USD864884
- USD873227
- USD900759
- USD901405
- USD903611
- USD904325
- USD904991
- USD923591
- USD932452
- USD945384
- US20220190556
- US20220231003
- US3290197
- US8098212000-1000
- US8202701000-1000
- USD1128311
- USD1175871
- USD1563809
- USD1563811
- USD1563907
- USD1563908
- USD1563910
- USD1692093
- USD1711446