Display Panel

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan application serial no. 110110174, filed on Mar. 22, 2021. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

The disclosure relates to a display panel, and in particular, relates to a display panel exhibiting a favorable repair yield.

Description of Related Art

In recent years, micro light-emitting diodes (micro-LEDs) are gradually gaining popularity due to their advantages when being applied in panels such as easy color adjustment, long light-emitting life, and no image burn-in.

However, as the resolution of the display panels continues to increase, the sizes and gaps of the pads configured to be bonded to the micro light-emitting diodes have decreased. Further, the number of crystal grain transfers of a single panel has also increased significantly, so the difficulty of crystal grain transfer has increased considerably. Therefore, development of a pixel structure that is easy to be repaired so as to increase the repair yield of high-resolution display panels is an important issue.

SUMMARY

The disclosure provides a display panel exhibiting a favorable production yield.

The disclosure provides a display panel including a substrate and a plurality of display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes a plurality of pad sets, a plurality of light-emitting devices, a first connecting wire, a second connecting wire, and a plurality of first cutting regions. Each of the pad sets has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

In an embodiment of the disclosure, the display panel further includes a plurality of active devices electrically connected to the first pads of the pad sets. The pad sets include: a first pad set and a second pad set electrically connected to one of the active devices. A gap between the first pad of the first pad set and the first pad of the second pad set in a first arrangement direction is less than or equal to a gap between the first pad and the second pad in each of the first pad set and the second pad set in a second arrangement direction. The first arrangement direction intersects the second arrangement direction.

In an embodiment of the disclosure, the display panel further includes a plurality of active devices electrically connected to the first pads of the pad sets. These pad sets further include a plurality of second pad sets. The first pad sets are electrically connected to a first active device of the active devices, and the second pad sets are electrically connected to a second active device of the active devices. Further, a number of the first pad sets is different from a number of the second pad sets.

In an embodiment of the disclosure, in the display panel, the first pad sets are configured to be electrically bonded to at least one first light-emitting device of the light-emitting devices, and the second pad sets are configured to be electrically bonded to at least one second light-emitting device of the light-emitting devices. Further, a light-emitting color of the at least one first light-emitting device is different from a light-emitting color of the at least one second light-emitting device.

In an embodiment of the disclosure, in the display panel, the light-emitting color of the at least one first light-emitting device is red, and the light-emitting color of the at least one second light-emitting device is green or blue. Further, the number of the first pad sets is greater than the number of the second pad sets.

In an embodiment of the disclosure, in the display panel, an arrangement direction of the first pad and the second pad in each of the first pad sets is different from an arrangement direction of the first pad and the second pad in each of the second pad sets.

In an embodiment of the disclosure, the display panel further includes another first connecting wire and a plurality of second cutting regions. The another first connecting wire is electrically connected to the first pads in the second pad sets. The second cutting regions are disposed on one side of each of the second pad sets. Two second connecting portions of the another first connecting wire and the second connecting wire connecting each of the second pad sets are located in one of the second cutting regions. Further, an arrangement direction of the first cutting regions intersects an arrangement direction of the second cutting regions.

In an embodiment of the disclosure, in the display panel, the light-emitting devices are flip-chip type light-emitting diodes.

In an embodiment of the disclosure, in the display panel, a vertical projection of the first connecting wire on the substrate does not overlap a vertical protection of the second connecting wire on the substrate.

In an embodiment of the disclosure, in the display panel, an arrangement direction of each of the first cutting regions and the corresponding one among the first pad sets intersects an arrangement direction of the first pad and the second pad of the corresponding first pad set.

In an embodiment of the disclosure, in the display panel, the first connecting wire and the second connecting wire belong to different film layers.

To sum up, in the display panel provided by an embodiment of the disclosure, the first connecting wire and the second connecting wire are respectively connected to the first pad and the second pad of the corresponding pad set through the two connecting portions in the cutting region disposed on one side of the corresponding pad set. As the two connecting portions are disposed in the same cutting region, the repair time of the display panel may be significantly shortened, the repair yield may be increased, and the overall production yield of the display panel may be improved.

To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic top view of a display panel according to a first embodiment of the disclosure.

FIG. 2 is a schematic diagram of a display pixel of FIG. 1 .

FIG. 3 is a cross-sectional schematic view of the display panel of FIG. 1 .

FIG. 4 is a schematic top view of the display pixel of FIG. 2 after being repaired.

FIG. 5 is a schematic top view of a display panel according to a second embodiment of the disclosure.

FIG. 6 is a schematic top view of a display panel according to a third embodiment of the disclosure.

FIG. 7 is a schematic top view of a display panel according to a fourth embodiment of the disclosure.

FIG. 8 is a schematic top view of a display panel according to a fifth embodiment of the disclosure.

FIG. 9 is a schematic top view of a display panel according to a sixth embodiment of the disclosure.

FIG. 10 is a cross-sectional schematic view of the display panel of FIG. 9 .

FIG. 11 is a schematic top view of a display panel according to a seventh embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

The terms used herein such as “about”, “approximate”, “essentially”, or “substantial” include a related value and an average within an acceptable deviation range of specific values determined by a person having ordinary skill in the art with consideration of discussed measurement and a specific number of errors related to the measurement (i.e., the limit of the measurement system). For example, “about” may mean within one or more standard deviations, or within, for example, ±30%, ±20%, ±15%, ±10%, ±5% of the stated value. Moreover, a relatively acceptable range of deviation or standard deviation may be chosen for the term “about”, “approximately”, “essentially”, or “substantially” as used herein based on measurement properties, cutting properties, or other properties, instead of applying one standard deviation across all the properties.

In the accompanying drawings, thicknesses of layers, films, panels, regions, and so on are exaggerated for clarity. It should be understood that when an element such as a layer, film, region or substrate is referred to as being “on” or “connected to” another element, it can be directly on or connected to the other element, or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or “directly connected to” another element, there are no intervening elements present. As used herein, the term “connected” may refer to physically connected and/or electrically connected (or coupled). Therefore, the electrical connection between two devices may include intervening elements existing between the two devices.

Descriptions of the disclosure are given with reference to the exemplary embodiments illustrated by the accompanying drawings in detail. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

FIG. 1 is a schematic top view of a display panel according to a first embodiment of the disclosure. FIG. 2 is a schematic diagram of a display pixel of FIG. 1 . FIG. 3 is a cross-sectional schematic view of the display panel of FIG. 1 . FIG. 4 is a schematic top view of the display pixel of FIG. 2 after being repaired.

With reference to FIG. 1 to FIG. 3 , a display panel 10 includes a substrate 100 and a plurality of display pixels PX. The display pixels PX are disposed on the substrate 100 . In this embodiment, the display pixels PX are arranged in an array. For instance, the display pixels PX are arranged in a plurality of rows and a plurality of columns in a direction X and a direction Y, but are not limited thereto. On the other hand, the display panel 10 may further include a plurality of signal lines electrically connected to the display pixels PX, such as a plurality of data lines (not shown), a plurality of scan lines (not shown), and a plurality of power lines PL. At least one data line, at least one scan line, and at least one power line corresponding to each of the display pixels PX are electrically connected, so as to receive a plurality of types of driving signals required by image displaying.

The display pixels PX includes a plurality of pad sets PS and a plurality of light-emitting devices LED. The pad sets PS are configured to be bonded to the light-emitting devices LED. In this embodiment, the pad sets PS of the display pixels PX may be divided into two parts, which are a plurality of pad sets PS 1 and a plurality of pad sets PS 2 , and an arrangement direction (e.g., direction Y) of the pad sets PS 1 is different from an arrangement direction (e.g., direction X) of the pad sets PS 2 . For instance, the pad sets PS 1 are configured to be electrically bonded to a light-emitting device LED 1 , and the pad sets PS 2 are configured to be electrically bonded to a light-emitting device LED 2 or a light-emitting device LED 3 . Herein, light-emitting colors of the light-emitting device LED 1 , the light-emitting device LED 2 , and the light-emitting device LED 3 are different from one another and may respectively be, for example, red, green, and blue, but are not limited thereto. In this embodiment, the light-emitting devices LED are, for example, flip-chip type light-emitting diodes. That is, each of the light-emitting devices LED may include an epitaxial structure layer ES, a first electrode E 1 , and a second electrode E 2 , and the first electrode E 1 and the second electrode E 2 are located on a same side of the epitaxial structure layer ES. The first electrode E 1 and the second electrode E 2 respectively are an anode and a cathode, for example.

Note that in this embodiment, in each of the display pixels PX, a number (e.g., two) of the pad sets PS 1 configured to be bonded to the light-emitting device LED 1 is greater than a number (e.g., one) of the pad sets PS 2 configured to be bonded to the light-emitting device LED 2 or the light-emitting device LED 3 . For instance, the probability of damage of the light-emitting device LED 1 is greater than that of the light-emitting device LED 2 and the light-emitting device LED 3 , and therefore, additional pad sets PS 1 may be arranged for repair, and the probability of the display panel being scrapped due to failure of being enabled of a few light-emitting devices LED may thus be lowered. That is, the pad set PS 1 on the upper left side of FIG. 2 may be used as a pad set for repair, so as to be electrically bonded to a light-emitting device LED 1 r (as shown in FIG. 4 ) for repair. It should be understood that, in other embodiments, the numbers of the pad sets PS 1 and the pad sets PS 2 may be adjusted according to actual product design or process risks to meet different repair requirements.

The pad sets PS includes first pads P 1 and second pads P 2 . In this embodiment, the arrangement direction (e.g., direction X) of the first pads P 1 and the second pads P 2 of the pad sets PS 1 is different from the arrangement direction (e.g., direction Y) of the first pads P 1 and the second pads P 2 of the pad sets PS 2 . Note that a gap S 1 between two pad sets PS 1 configured to be bonded to the light-emitting device LED 1 in the arrangement direction (e.g., direction Y) is less than or equal to a gap S 2 between the first pad P 1 and the second pad P 2 in each of the pad sets PS 1 in the arrangement direction (e.g., direction X). In this way, the risk of short circuit between the first pads P 1 and the second pads P 2 of the pad sets PS 1 due to alignment errors or/and solder overflow during the transposition and bonding process of the light-emitting device LED 1 may be reduced.

Further, the display pixels PX also include a plurality of active devices T, a plurality of first connecting wires, and a second connecting wire CW 2 . In this embodiment, the active devices T are a first active device T 1 , a second active device T 2 , and a third active device T 3 , and the first connecting wires are a first connecting wire CW 1 - 1 , a first connecting wire CW 1 - 2 , and a first connecting wire CW 1 - 3 . The plural pad sets PS 1 configured to be bonded to the light-emitting device LED 1 are electrically connected to the first active device T 1 through the first connecting wire CW 1 - 1 . The pad set PS 2 configured to be bonded to the light-emitting device LED 2 is electrically connected to the second active device T 2 through the first connecting wire CW 1 - 1 . Another pad set PS 2 configured to be bonded to the light-emitting device LED 3 is electrically connected to the third active device T 3 through the first connecting wire CW 1 - 3 . These pad sets PS are all electrically connected to one power line PL through the second connecting wire CW 2 . For instance, the first pads P 1 and the second pads P 2 of the pad sets PS are respectively configured to be bonded to the anodes (i.e., first electrodes E 1 ) and the cathodes (i.e., second electrodes E 2 ) of the light-emitting devices LED. These active devices T may be coupled to a system high voltage (OVDD), and the power lines PL may be coupled to a system low voltage (OVSS), but are not limited thereto.

Note that the display pixels PX further comprise a plurality of cutting regions CR, and these cutting regions CR are adjacent to one side of each of the pad sets PS 1 . Two connecting portions CW 1 c and CW 2 c of the first connecting wire CW 1 - 1 and the second connecting wire CW 2 connecting each of the first pad sets PS 1 are both located in the corresponding cutting regions CR. More specifically, the arrangement direction (e.g., direction Y) of the cutting regions CR and the corresponding pad sets PS 1 intersects the arrangement direction (e.g., direction X) of the first pads P 1 and the second pads P 2 in these corresponding pad sets PS 1 .

With reference to FIG. 4 together, for instance, when the light-emitting device LED 1 bonded to the pad set PS 1 on the lower left side of FIG. 2 is detected as an abnormal light-emitting device LED 1 x in a subsequent process, the pad set PS 1 on the upper left side of FIG. 2 may be used to bond the light-emitting device LED 1 r for repair. After the light-emitting device LED 1 r for repair is bonded to the pad set PS 1 for repair, a cutting step is performed, so as to remove the two connecting portions CW 1 c and CW 2 c of the first connecting wire CW 1 - 1 and the second connecting wire CW 2 located in the cutting region CR on a lower side of the abnormal light-emitting device LED 1 x . In other words, in a repaired display panel 10 R, a first connecting wire CW 1 - 1 ′ and a second connecting wire CW 2 ′ of a display pixel PX-R respectively have a disconnection CW 1 a and a disconnection CW 2 a in the cutting region CR where the cutting step is performed, and in this way, the abnormal light-emitting device LED 1 x is electrically insulated from the two connecting wires.

Nevertheless, the disclosure should not be construed as limited thereto. In other embodiments, the cutting step of the two connecting wires may also be completed before the light-emitting device LED 1 r for repair is bonded to the pad set PS 1 , and a repairing process may optionally include a step of removing the light-emitting device LED 1 x . In this embodiment, removal of the connecting portions of the connecting wires may be implemented through a laser cutting process. Areas of vertical projections of the cutting regions CR on the substrate 100 are, for example, in a range between 140 μm 2 and 350 μm 2 , but are not limited thereto. In other embodiments, the cutting regions may also cover one of the first connecting wire CW 1 - 1 ′ and the second connecting wire CW 2 ′ only. That is, only one connecting wire is cut. Therefore, the areas of the vertical projections of the cutting regions on the substrate 100 are, for example, in a range between 49 μm 2 and 100 μm 2 .

In particular, by arranging the connecting portion CW 1 c of the first connecting wire CW 1 - 1 and the connecting portion CW 2 c of the second connecting wire CW 2 in the same cutting region CR, the number of cuts required may be significantly lowered, and repair time is thus shortened. Therefore, a repair yield and an overall production yield of the display panel may be improved.

Further, a method of forming the active devices T may include the following steps. A semiconductor pattern SC, a gate insulating layer 110 , a gate GE, an interlayer insulating layer 120 , a source SE, and a drain DE are sequentially formed on the substrate 100 . The semiconductor pattern SC has a channel region CH, a source region SR and a drain region DR located on opposite sides of the channel region CH, a lightly-doped source region LSR connected between the channel region CH and the source region SR, and a lightly-doped drain region LDR connected between the channel region CH and the drain region DR. Further, the source SE and the drain DE penetrate the gate insulating layer 110 and the interlayer insulating layer 120 to be electrically connected to the source region SR and the drain region DR of the semiconductor pattern SC, respectively. In this embodiment, the power line PL and the gate GE may optionally belong to a same film layer. That is, the power line PL and the gate GE of the active device T may be formed of a same material in a same process (e.g., a lithography process), but are not limited thereto.

In this embodiment, the gate GE of the active device T may be optionally arranged above the semiconductor pattern SC to form a top-gate thin film transistor (TFT), which should however not be construed as a limitation in the disclosure. According to other embodiments, the gate GE of the active device T may also be arranged below the semiconductor pattern SC to form a bottom-gate TFT. On the other hand, a material of the semiconductor pattern SC is, for example, a polysilicon material. That is, the active device T is, for example, a low temperature poly-silicon thin film transistor (LIPS TFT). Nevertheless, the disclosure should not be construed as limited thereto. In other embodiments, the active device may also be an amorphous silicon TFT (a-Si TFT), a micro-Si TFT, or a metal oxide transistor.

Note that the semiconductor pattern SC, the gate insulating layer 110 , the gate GE, the interlayer insulating layer 120 , the source SE, and the drain DE may be applied to any semiconductor pattern, any gate insulating layer, any gate, any interlayer insulating layer, any source, and any drain of a display panel known to a person having ordinary skill in the art to be implemented. Further, the semiconductor pattern SC, the gate insulating layer 110 , the gate GE, the interlayer insulating layer 120 , the source SE, and the drain DE may be formed by any method known to a person having ordinary skill in the art, so description thereof is not provided herein.

On the other hand, the display panel 10 further includes a plurality of planarization layers 130 , 140 , and 150 and a plurality of transfer patterns TP 1 , TP 2 , and TP 3 . For instance, the planarization layer 130 and the planarization layer 140 are disposed between the active device T and the first connecting wire CW 1 - 1 (or the second connecting wire CW 2 ), and the planarization layer 150 is disposed between the pad set PS and the first connecting wire CW 1 - 1 (or the second connecting wire CW 2 ). The first connecting wire CW 1 - 1 is electrically connected to the drain DE of the active device T through the transfer pattern TP 2 . The second connecting wire CW 2 is electrically connected to the power line PL through the transfer pattern TP 1 and the transfer pattern TP 3 . The first pad P 1 and the second pad P 2 of the pad set PS penetrate the planarization layer 150 to be electrically connected to the first connecting wire CW 1 - 1 and the second connecting wire CW 2 , respectively.

Note that in this embodiment, the first connecting wires CW 1 - 1 , CW 1 - 2 , and CW 1 - 3 and the second connecting wire CW 2 may be optionally belong to the same film layer. Therefore, a vertical projection of each of the first connecting wires on the substrate 100 does not overlap a vertical protection of the second connecting wire CW 2 on the substrate 100 . That is, the first connecting wires CW 1 - 1 , CW 1 - 2 , and CW 1 - 3 do not overlap the second connecting wire CW 2 in a direction Z.

Some other embodiments are listed below to illustrate the disclosure in detail. Identical reference numerals are used to represent identical components, and descriptions of identical technical contents are omitted. For the omitted parts, description thereof may be found with reference to the foregoing embodiments, which is described in detail below.

FIG. 5 is a schematic top view of a display panel according to a third embodiment of the disclosure. With reference to FIG. 5 , the difference between a display panel 10 A of this embodiment and the display panel 10 of FIG. 2 lies in that: different numbers of pad sets configured to be bonded to the light-emitting device LED 2 and the light-emitting device LED 3 in the display pixel are provided. In this embodiment, in a display pixel PX-A, the numbers of pad sets PS configured to be bonded to the light-emitting device LED 1 , the light-emitting device LED 2 , and the light-emitting device LED 3 are all two. Further, arrangement of two pad sets PS 2 A configured to be bonded to the light-emitting device LED 2 and two pad sets PS 3 A configured to be bonded to the light-emitting device LED 3 is similar to the arrangement of the two pad sets PS 1 configured to be bonded to the light-emitting device LED 1 . Therefore, the related paragraphs of the foregoing embodiments may be referenced, and detailed description is thus not repeated herein.

On the other hand, in this embodiment, cutting regions CR 2 are also provided on one side of each of the pad sets PS 2 A perpendicular to the arrangement direction of the first pads P 1 and the second pads P 2 thereof. Further, a connecting portion CW 1 c of a first connecting wire CW 1 - 2 A and a connecting portion CW 2 c of a second connecting wire CW 2 A connecting the same pad set PS 2 A are both located in the corresponding cutting regions CR 2 . Similarly, cutting regions CR 3 are also provided on one side of each of the pad sets PS 3 A perpendicular to the arrangement direction of the first pads P 1 and the second pads P 2 thereof. Further, the connecting portion CW 1 c of a first connecting wire CW 1 - 3 A and the connecting portion CW 2 c of the second connecting wire CW 2 A connecting the same pad set PS 3 A are both located in the corresponding cutting regions CR 3 .

The way of repairing the light-emitting device LED 2 or the light-emitting device LED 3 of this embodiment is similar to that of repairing the light-emitting device LED 1 in the display panel 10 of FIG. 2 . Therefore, the related paragraphs of the foregoing embodiments may be referenced, and detailed description is thus not repeated herein.

FIG. 6 is a schematic top view of a display panel according to a third embodiment of the disclosure. With reference to FIG. 6 , the difference between a display panel 10 B of this embodiment and the display panel 10 A of FIG. 5 lies in that: the arrangement direction of part of the pad sets is different from the arrangement direction of other pad sets. To be specific, in the display panel 10 B, the arrangement direction of two pad sets PS 2 A′ of a display pixel PX-B configured to be bonded to the light-emitting device LED 2 intersects the arrangement direction of the two pad sets PS 1 of the display pixel PX-B configured to be bonded to the light-emitting device LED 1 and the arrangement direction of two pad sets PS 3 A of the display pixel PX-B configured to be bonded to the light-emitting device LED 3 .

Therefore, the arrangement direction (e.g., direction X) of two cutting regions CR 2 ′ disposed on one side of each of the pad sets PS 2 A′ intersects the arrangement direction (e.g., direction Y) of the two cutting regions CR 1 disposed on one side of each of the pad sets PS 1 and the arrangement direction of the two cutting regions CR 3 disposed on one side of each of the pad sets PS 3 A. The arrangement direction of the two connecting portions CW 1 c and CW 2 c of a first connecting wire CW 1 - 2 B and a second connecting wire CW 2 B connecting the same pad set PS 2 A′ also intersects the arrangement direction of the two connecting portions CW 1 c and CW 2 c of the first connecting wire CW 1 - 1 and the second connecting wire CW 2 B connecting the same pad set PS 1 and the arrangement direction of the two connecting portions CW 1 c and CW 2 c of the first connecting wire CW 1 - 3 A and the second connecting wire CW 2 B connecting the same pad set PS 3 A.

FIG. 7 is a schematic top view of a display panel according to a fourth embodiment of the disclosure. With reference to FIG. 7 , the difference between a display panel 20 of this embodiment and the display panel 10 of FIG. 2 lies in that: the number of pad sets PS 1 configured to be bonded to the light-emitting device LED 1 in a display pixel PX-C of the display panel 20 is three. That is, the display pixel PX-C of the display panel 20 of this embodiment may repair the light-emitting device LED 1 twice.

In this embodiment, the display pixel PX-C includes two cutting regions CRa and two cutting regions CRb. Among the three pad sets PS 1 , each of the two pad sets PS 1 located outside is provided with one cutting region CRa on one side perpendicular to the arrangement direction of the first pad P 1 and the second pad P 2 thereof, and the two opposite sides of the pad set PS 1 located between these two pad sets PS 1 are provided with these cutting regions CRb in the arrangement direction of the first pad P 1 and the second pad P 2 thereof.

Note that a connecting portion CW 1 c ′ of the a first connecting wire CW 1 - 1 C connecting the middle pad set PS 1 and a connecting portion CW 2 c ′ of a second connecting wire CW 2 C connecting the same pad set PS 1 are disposed in these two cutting regions CRb. Therefore, after the light-emitting device for repair (e.g., the light-emitting device LEDr 1 in FIG. 4 ) is bonded to the adjacent pad set PS 1 provided with one cutting region CRa, the abnormal light-emitting device LED 1 originally bonded to the middle pad set PS 1 is cut twice. The arrangement of the cutting regions CRa, the first connecting wire CW 1 - 1 C, and the second connecting wire CW 2 C of the display pixel PX-C is similar to the arrangement of the cutting regions CR, the first connecting wire CW 1 - 1 , and the second connecting wire CW 2 of the display pixel PX in FIG. 2 , Therefore, the related paragraphs of the foregoing embodiments may be referenced, and detailed description is thus not repeated herein.

FIG. 8 is a schematic top view of a display panel according to a fifth embodiment of the disclosure. With reference to FIG. 8 , the difference between a display panel 20 A of this embodiment and the display panel 20 of FIG. 7 lies in that: the arrangement of the second connecting wire is different, and the number of cutting regions is also different. To be specific, in a display pixel PX-D, a connecting portion CW 2 c ″ of a second connecting wire CW 2 D connecting the middle pad set PS 1 and a connecting portion CW 1 c ′ of the first connecting wire CW 1 - 1 C connecting the same pad set PS 1 are disposed in the same cutting region CRb′. That is, after the light-emitting device for repair (e.g., the light-emitting device LEDr 1 in FIG. 4 ) is bonded to the adjacent pad set PS 1 provided with one cutting region CRa, the abnormal light-emitting device LED 1 originally bonded to the middle pad set PS 1 is cut twice. Accordingly, the repair time of the display panel 20 A may be greatly shortened, and the repair yield and overall production yield may be improved.

FIG. 9 is a schematic top view of a display panel according to a sixth embodiment of the disclosure. FIG. 10 is a cross-sectional schematic view of the display panel of FIG. 9 . With reference to FIG. 9 and FIG. 10 , the difference between a display panel 20 B of this embodiment and the display panel 20 A of FIG. 8 lies in that: the film layer to which the second connecting wire belongs is different. In this embodiment, in a display pixel PX-E, a second connecting wire CW 2 E and a plurality of first connecting wires may be optionally belong to different film layers. For instance, the second connecting wire CW 2 E and the transfer pattern TP 2 may belong to the same film layer. The second pad P 2 of the pad set PS 1 is electrically connected to the second connecting wire CW 2 E through another transfer pattern TP 4 , and the second connecting wire CW 2 E is electrically connected to the power line PL through the transfer pattern TP 1 . Herein, the transfer pattern TP 4 and the first connecting wire CW 1 - 1 C belong to the same film layer.

FIG. 11 is a schematic top view of a display panel according to a seventh embodiment of the disclosure. With reference to FIG. 11 , the difference between a display panel 20 C of this embodiment and the display panel 20 B of FIG. 9 lies in that: the structure forming the second connecting wire is different. In this embodiment, in a display pixel PX-F, a second connecting wire CW 2 F may include a first extending segment CW 2 e 1 and a second extending segment CW 2 e 2 , and the two extending segments belong to different film layers. For instance, the first extending segment CW 2 e 1 of the second connecting wire CW 2 F and a plurality of first connecting wires may optionally belong to the same film layer, and the second extending segment CW 2 e 2 of the second connecting wire CW 2 F and the transfer pattern TP 2 in FIG. 10 may optionally belong to the same film layer. Herein, the first extending segment CW 2 e 1 is electrically connected to the second extending segment CW 2 e 2 through a contact window 140 h of the planarization layer 140 . In this way, increased circuit design margin of the display pixels is provided.

In view of the foregoing, in the display panel provided by an embodiment of the disclosure, the first connecting wire and the second connecting wire are respectively connected to the first pad and the second pad of the corresponding pad set through the two connecting portions in the cutting region disposed on one side of the corresponding pad set. As the two connecting portions are disposed in the same cutting region, the repair time of the display panel may be significantly shortened, the repair yield may be increased, and the overall production yield of the display panel may be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents.